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 MURHD560T4
Preferred Device
MEGAHERTZTM Power Rectifier
Features and Benefits
* * * * *
Ultrafast 30 Nanosecond Recovery Times 175C Operating Junction Temperature High Temperature Glass Passivated Junction High Voltage Capability to 600 Volts These are Pb-Free Devices
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Applications
ULTRAFAST RECTIFIER 5.0 AMPERES 600 VOLTS
1 3 4 12 3 DPAK CASE 369C 4
* Power Supplies * Inverters * Free Wheeling Diodes
Mechanical Characteristics
* * * * * *
Case: Epoxy, Molded Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 0.4 g (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds ESD Ratings: Machine Model = C (>400 V) Human Body Model = 3B (>8000 V)
MARKING DIAGRAM
YWW UH560G
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 159C) Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Operating Junction and Storage Temperature Range Symbol VRRM VRWM VR IF(AV) IFSM Value 600 Unit V UH560G Y WW = Device Code = Year = Work Week
5.0 50
A A
ORDERING INFORMATION
Device MURHD560T4G Package DPAK (Pb-Free) Shipping 2500 /Tape & Reel
TJ, Tstg
-65 to +175
C
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2005
1
December, 2005 - Rev. 2
Publication Order Number: MURHD560/D
MURHD560T4
THERMAL CHARACTERISTICS
Rating Maximum Thermal Resistance, Junction to Case Maximum Thermal Resistance, Junction to Ambient (Note 1) Symbol RJC RJA Value 2.5 49.5 Unit C/W C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2) (IF = 5.0 Amps, TC = 25C) (IF = 5.0 Amps, TC = 125C) Maximum Instantaneous Reverse Current (Note 2) (Rated dc Voltage, TC = 25C) (Rated dc Voltage, TC = 125C) Maximum Reverse Recovery Time (IF = 1.0 Amp, di/dt = 50 Amps/ms, VR = 30 V, TJ = 25C) VF 2.7 1.65 IR 10 70 trr 30 ns mA V
1. Rating applies when surface mounted on a 1.5 mm FR4 PC board with a 1 oz. thick, 700 mm2 Cu area. 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%.
100 IF, FORWARD CURRENT (AMPS) IF, FORWARD CURRENT (AMPS)
100
10 125C
150C 100C
10
150C 125C 100C
1
25C
1
25C
0.1
0.1
0.01 0 0.5 1.0 1.5 2.0 2.5 3.0 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.01 0 1.0 2.0 3.0 4.0 5.0 6.0 VF, MAXIMUM FORWARD VOLTAGE (VOLTS)
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
1.0E-4 IR, REVERSE CURRENT (AMPS) 150C 1.0E-5 125C 100C 1.0E-6
IR, MAXIMUM REVERSE CURRENT (AMPS)
1.0E-3 150C 125C 100C
1.0E-4
1.0E-5
1.0E-7
1.0E-6 25C
1.0E-8
25C
1.0E-7
1.0E-9 0 100 200 300 400 500 600 VR, REVERSE VOLTAGE (VOLTS)
1.0E-8 0 100 200 300 400 500 600 VR, REVERSE VOLTAGE (VOLTS)
Figure 3. Typical Reverse Current
Figure 4. Maximum Reverse Current
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2
MURHD560T4
100 PFO, AVERAGE POWER DISSIPATION (WATTS) 90 C, CAPACITANCE (pF) 80 70 60 50 40 30 20 10 0 0 25 50 75 100 125 150 175 200 VR, REVERSE VOLTAGE (VOLTS) 20 TJ = 175C 15 SQUARE WAVE 10 dc 5
0 0 1 2 3 4 5 6 7 8 IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Typical Capacitance
Figure 6. Forward Power Dissipation
IF, AVERAGE FORWARD CURRENT (AMPS)
9 8 7 6 5 4 3 2 1 0 100 110 120 130 140 150 160 170 180 SQUARE WAVE dc RqJC = 2.5C/W TJ = 175C
TC, CASE TEMPERATURE (C)
Figure 7. Current Derating
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3
MURHD560T4
R(t), TRANSIENT THERMAL RESISTANCE 10
0.5 1 0.2 0.1 0.05 0.01 0.1 Single Pulse P(pk) t1 t2
DUTY CYCLE, D = t1/t2 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 100 1000
Figure 8. Thermal Response, Junction to Case
R(t), TRANSIENT THERMAL RESISTANCE
100 0.5 10 0.2 0.1 0.05 0.01 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 t, TIME (s) 0.1 1.0 10 P(pk) t1 t2
1
DUTY CYCLE, D = t1/t2 100 1000
Figure 9. Thermal Response, Junction to Ambient
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4
MURHD560T4
PACKAGE DIMENSIONS
DPAK CASE 369C-01 ISSUE O
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.235 0.245 0.250 0.265 0.086 0.094 0.027 0.035 0.018 0.023 0.037 0.045 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.180 0.215 0.025 0.040 0.020 --- 0.035 0.050 0.155 --- MILLIMETERS MIN MAX 5.97 6.22 6.35 6.73 2.19 2.38 0.69 0.88 0.46 0.58 0.94 1.14 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.57 5.45 0.63 1.01 0.51 --- 0.89 1.27 3.93 ---
-T- B V R
4
SEATING PLANE
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005)
M
DIM A B C D E F G H J K L R S U V Z
T
RECOMMENDED FOOTPRINT
6.20 0.244 3.0 0.118
2.58 0.101
5.80 0.228
1.6 0.063
6.172 0.243
SCALE 3:1
mm inches
MEGAHERTZ is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Phone: 81-3-5773-3850 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
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5
MURHD560/D


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